A peak is also observed for diffracted X-rays 21 coming from the tin-copper plating in addition to the fluorescent X-rays Sn—K X-rays 22 from the tin and the fluorescent X-rays Cu—K X-rays 23 from the copper. Method and apparatus for measuring the thicknesses of thin layers by means of x-ray fluorescence. Here, when the sample to be measured doanload a tin alloy plating layer including ten percent or less copper by weight on a material constituted by one or more layers including copper, copper concentration of the tin alloy plating layer is determined using the intensity of peaks caused by diffracted X-rays in X-ray spectra information acquired by the count circuit.
Wet Film Wheels By rolling the gauge through a wet coating, the center disc eventually touches the film. Manual “C” Frame – operator manually positions “C” frame on sheet.
Further, the thickness of the plating can be measured using Sn—K X-rays and a calibration curve can therefore be made by measuring standard materials of known thicknesses. In this embodiment, a counting circuit comprises a linear amplifier 9 and a pulse height discriminator Simultaneous measurement method of the composition to the thickness of the coating.
When the sample to be measured is irradiated with primary X-rays, fluorescent X-rays peculiar to the elements included in the sample to be measured are generated.
This is expressed in the form of an equation in the following manner. Accuracy – state of the art high gaue electronics and logarithmic linearization performed by the software assures highly accurate measurements of various materials while minimizing the hardware requirements. The diameter of the mark on the lens is measured and, using the supplied conversion table, the thickness of the coating can be easily assessed. Measuring coatings before they have cured can predict the final film thickness.
Thickness of the tin-copper alloy plating sample 4 is determined using the peak intensity of Sn—K X-rays and the calibration curve by a thickness determining means. Absorption correction via scattered radiation in energy-dispersive X-ray fluorescence analysis for samples of variable composition and thickness.
X-ray coating thickness gauge
Energy dispersive x-ray fluorescence measuring instrument EDXRF to measure thin coatings and coating systems on very small flat structures. Through the use of non-contact ultrasonic technology the density of the powder can be measured providing a predictive value of the final cured coating thickness.
The gauge is calibrated based on these variations, and provides a continuous, high speed, non-contact, accurate and reliable measurement of thickness.
This point on the scale indicates the thickness. Quantitative measuring method and apparatus of metal phase using x-ray dlwnload method, and method for making plated steel sheet using them.
USA1 – X-ray coating thickness gauge – Google Patents
According to the present invention, in the measurement of the thickness and copper concentration of tin downolad plating layers including copper of ten percent by weight or less employing an X-ray thickness measurer, copper concentration can be determined from a single obtained X-ray spectrum using diffracted X-ray intensity, and copper concentration can therefore be determined without being influenced by the plating thickness or without being influenced by the material.
Automatic Standardization – this provides a fast, accurate standardization cycle. doqnload
Absolute helicity-dependent photoabsorption cross sections of Fe thin films and quantitative evaluation of magnetic-moment determination. Also indicates location of out of tolerance material. If, at this time, the subject to be measured is crystalline, diffracted X-rays are also generated psf addition to the fluorescent X-rays. Measurements on very small flat components and structures such as printed circuit boards, contacts or lead frames.
The direct benefits provided by this measurement are documented compliance with quality specifications, improved process control and a reduction in scrap. Automatic Alloy Compensation – the system automatically calculates the curve compensation for different alloys. Typical fields of application.
Quantitative electron microprobe analysis using a lithium drifted silicon detector. The thickness display changes from green to red if the thickness goes out of tolerance. The following downlload a description, with reference to FIG.
Wet Film & Powder Thickness
The unknown material is then measured and copper concentration and plating thickness tyickness determined using the respective calibration curves. Analytical method for determining crystallographic phases of a measuring sample. An X-ray coating thickness gauge, comprising: Diagnostics – system faults are stored and displayed on demand. Year of fee payment: A series of standard materials is measured in advance, parameters for these coefficients are determined, the measured intensity obtained from the as-yet unknown material is substituted so that a simultaneous equation is solved to determine the thickness of the plating and the concentration of the copper.
We have a wide selection of wet film combs from long edge combs to hexagonal combs through to punched aluminium combs. Institut Fur Electronik Und Messtechnik. Dual Beam Systems – enable the measurement of a wider variety of products.
X-Ray Fluorescence Tester : XDV-µ
Highlight X-ray fluorescence analysis is widely used for measuring the coating and plating film thickness of electronic components and other products as it can perform non-destructive and non-contact simultaneous measurement of yhickness layer coatings. Engineering Set-Up Page This page is used to customize the system and to test all inputs and outputs.
The concentration of copper in the tin-copper alloy plating layer can then be determined by irradiating the tin-copper alloy plating material with primary X-rays to acquire X-ray spectra and using the peak intensities of the diffracted X-rays derived from the tin-copper intermetallic compound. When X-rays from an X-ray generator irradiate the sample, tin fluorescent X-rays hereinafter referred to as Sn—K X-rays and copper fluorescent X-rays hereinafter referred to as Cu—K X-rays are emitted from the tin and the copper within the alloy plating.